目标电镀系统

Designed to plate with a small volume of plating solution (expensive isotopes!) and to use a rotating anode, the system electroplates two targets simultaneously. The custom controller keeps the plating solution at a fixed temperature and a constant plating current. The pulse plating option is provided with a fully adjustable frequency and duty cycle. Standard plating cell accommodates ASD Inc. targets, but cells for different target sizes can be provided.